SP6686

Overview

# of Channels	1
Max Current/Ch (mA)	400
LEDs/ Ch.	1
Operating Voltage (MIN) (V)	2.7
Operating Voltage (MAX) (V)	5.5
Reference Voltage	50
Frequency (MHz)	2.4
Max Voltage (V)	5.5
Quiescent Current (μA)	500
Efficiency (%)	94
Package	DFN-10
Application	Flash
Features	Charge pump topology, Enable pin, flash/torch mode, Adjustable flash current, soft-start Overvoltage, overcurrent and temperatur

The SP6686 is a current-regulated charge pump ideal for powering high brightness LEDs for camera flash applications.

The charge pump can be set to regulate two current levels for FLASH and TORCH modes. The SP6686 automatically switches modes between step-up and step-down ensuring that LED current does not depend on the forward voltage. A low current sense reference voltage (50mV) allows the use of small 0603 current sensing resistors.

The SP6686 is designed to operate from a single cell lithium-ion battery or fixed 3.3V or 5.0V power rails and is available in a RoHS compliant, “green”/halogen free space saving 10-pin 3mmx3mm DFN package.

Output current up to 400mA
Up to 94% efficiency in torch mode
Automatic soft-start limits inrush current
Adjustable FLASH mode
x1 and x2 automatic modes for high efficiency
Minimum external components: no inductors
High frequency operation: 2.4MHz
Low 50mV reference for low loss sensing
1μA shutdown current
PWM dimming control
Automatic switchover between buck/boost
Overvoltage protection on output
Overcurrent/temperature protection
Low ripple and EMI
Space Saving 10-pin 3mm x 3mm DFN package

Documentation & Design Tools

All Types Data Sheets Application Notes Product Briefs & Brochures Symbols & Footprints User Guides & Manuals

Type	Title	Version	Date	File Size
Data Sheets	SP6686 400mA Buck/Boost Charge Pump LED Driver	2.0.1	February 2020	1009.7 KB
Application Notes	AN200, Downloading and Installing CAD Symbols and Footprints with Ultra Librarian		April 2019	1.2 MB
Application Notes	ANP-17, Design Considerations For Cell Phone Camera Flash Drivers	A	November 2006	101.8 KB
User Guides & Manuals	SP6686 Evaluation Board Manual	1.0.0	April 2005	180 KB
Product Brochures	Power Management Brochure		October 2020	2.4 MB
Symbols & Footprints	SP6686ER-L/TR CAD File (.bxl)		September 2018	24.7 KB

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Quality & RoHS

Part Number	RoHS \| Exempt	RoHS	Halogen Free	REACH	TSCA	MSL Rating / Peak Reflow	Package
SP6686ER-L/TR	N	Y	Y	Y	Y	DFN10 3x3 OPT1	Y

Click on the links above to download the Certificate of Non-Use of Hazardous Substances.

Additional Quality Documentation may be available, please Contact Support.

Parts & Purchasing

Part Number	Pkg Code	Min Temp	Max Temp	Status	Suggested Replacement	Order Samples
SP6686ER	DFN10 3x3 OPT1	-40	85	OBS
SP6686ER-2-L	DFN10 3x3 OPT1	-40	85	OBS
SP6686ER-2-L/TR	DFN10 3x3 OPT1	-40	85	OBS
SP6686ER-L	DFN10 3x3 OPT1	-40	85	OBS	SP6686ER-L/TR
SP6686ER-L/TR	DFN10 3x3 OPT1	-40	85	Active		Order
SP6686ER/TR	DFN10 3x3 OPT1	-40	85	OBS

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Part Status Legend
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EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
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PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.

Packaging

Pkg Code	Details	Quantities	Dimensions
DFN10 3x3 OPT1	JEDEC Reference: MSL Pb-Free: L1 @ 260ºC MSL SnPb Eutectic: ThetaJA: 40.5C/W	Bulk Pack Style: n/a Quantity per Bulk Pack: n/a Quantity per Reel: 3000 Quantity per Tube: n/a Quantity per Tray: n/a Reel Size (Dia. x Width x Pitch): 330 x 12 x 8 Tape & Reel Unit Orientation: Quadrant 1	Dimensions: mm Length: 3 Width: 3 Thickness: 1.00 Lead Pitch: 0.5

Notifications

Distribution Date	Description	File
01/31/2022	To increase manufacturing capacity, MaxLinear has qualified UTL3 extension site as an alternate assembly site together with UTL1 for QFN and DFN products.
01/27/2017	Qualification of alternate assembly subcon, ANST, China.
07/26/2016	Product discontinuation notification. Discontinued.
10/04/2013	Addition of an alternate qualified assembly site, UTAC Thailand, for assembly using copper or gold wire bonding. Material change and alternate assembly site.
07/15/2009	Wafer fabrication process flow in Jazz Semiconductor foundry has been modified and two metal masks were revised. Applicable datasheets are changed to specify all pins meet ESD-HBM of 2KV except EN pin that meets 1KV. There is no change to Form, Fit, or Function as stated in the applicable datasheets except for the ESD rating as stated above. Process standardization to eliminate product specific flow.
02/28/2007	Product Obsolescence Letter and Discontinuation Notification. Discontinued.

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